|
|
|
Staktek and Toshiba America Electronic Components, Inc. Announce 576Mb Network FCRAM
Stacked and Packaged DRAM Doubles Current Industry Standard for
Enterprise Network Technology
AUSTIN, Texas & IRVINE, Calif.—(BUSINESS WIRE)—June 1, 2004—
Staktek Holdings, Inc. (Nasdaq:STAK) a rapidly growing provider of
high-density packaged memory stacking solutions, and Toshiba America
Electronic Components, Inc. (TAEC) today announced the availability of
the first 576Mb(1) DRAM combining Staktek's High Performance
StakPak(R) technology and Network Fast Cycle RAM (FCRAM(TM))
technology developed by Toshiba Corp. (Toshiba).
The PDS-14100-00 is a 16Mx36 Network FCRAM for the
high-performance enterprise networking space.
"With our patented High Performance StakPak BGA stacking
technology, OEMs using Toshiba's Network FCRAM can double the size of
their packet buffers without sacrificing valuable board real estate,"
said Bill Askins, vice president of worldwide marketing and sales for
Staktek. "The same doubling of memory density in a given space that PC
server OEMs have enjoyed over the past decade using Staktek technology
is now available to OEMs in the Enterprise Network market to increase
product performance without waiting for the next generation of network
memory device to be introduced."
Toshiba's Network FCRAMs incorporate enhanced DRAM technology to
achieve a large memory capacity and random access time rivaling the
speed of SRAM. Network FCRAM's fast random access and fast data
transfer rates make it ideally suited as a high-performance, low-cost
replacement to DDR SDRAM and High Speed SRAM for buffer memory and
look-up table memory in networking applications, including routers and
switches. The specification of Toshiba's Network FCRAM(TM) is fully
compatible with Samsung's Network-DRAM(TM).
"We have a number of OEM customers demanding large density with
limited board space, and Staktek's solution enables customers with
more choices by stacking our current generation Network FCRAM," said
Scott Beekman, business development manager for communications memory
products at TAEC.
"Staktek's High Performance StakPak technology is unique in that
it provides controlled impedance interconnections and high-speed
switching noise decoupling internal to the stack. These features are
important as the industry continues on the path of higher and higher
memory speeds," said David Roper, director of engineering for Staktek.
Pricing and Availability
The PDS-14100-00 stacked 576Mb Network FCRAM is planned to be
available in Q3 2004 at a sampling price beginning at $90.
About Staktek Holdings
Staktek is a rapidly growing provider of IP and manufacturing
services for the cost-effective miniaturization of electronic
components and systems for original equipment manufacturers, silicon
manufacturers, memory module manufacturers and contract manufacturers.
Staktek's high-density memory stacking solutions increase operational
performance by doubling, tripling, or quadrupling memory in the same
physical footprint as the underlying packaged component. With an IP
portfolio of more than 70 patents and patent applications pending, the
company offers flexibility for customers, including outsourced
manufacturing, technology licensing and custom engineering.
Headquartered in Austin, Texas, Staktek employs more than 400 people
at its two world-class manufacturing locations in Austin, Texas and
Reynosa, Mexico. For more information, visit http://www.staktek.com.
Staktek is a trademark of Staktek Group LP. All other products
names noted herein may be trademarks of their respective holders.
About TAEC
Combining quality and flexibility with design engineering
expertise, TAEC brings a breadth of advanced, next-generation
technologies to its customers. This broad offering includes
semiconductors, flash memory-based storage solutions, optical
communication devices, displays and rechargeable batteries for the
computing, wireless, networking, automotive and digital consumer
markets. TAEC is an independent operating company owned by Toshiba
America, Inc., a subsidiary of Toshiba, the fifth largest
semiconductor company worldwide in terms of global sales for the year
2003 according to Gartner/Dataquest's Worldwide Semiconductor Market
Share Ranking. Toshiba is a world leader in high-technology products
with more than 300 major subsidiaries and affiliates worldwide. For
additional company and product information, please visit TAEC's
website at chips.toshiba.com. For technical inquiries, please e-mail
Tech.Questions@taec.toshiba.com.
(1) When used herein, megabit and Mb means 1,024X1,024 = 1,048,576
bits. Usable capacity may be less. For details, please refer
to specifications.
FCRAM (Fast Cycle RAM) is a trademark of Fujitsu Limited, Japan.
Network-DRAM is a trademark or a registered trademark of Samsung
Electronics Co., Ltd. Korea.
Contact:
Staktek, Austin
Bill Askins, 512-454-9531
baskins@staktek.com
or
Shelton, Dallas
Investor Relations:
Barry Sievert, 972-239-5119, x134
investors@staktek.com
or
Media Relations:
Katie Olivier, 972-239-5119, x128
pr@staktek.com
|
|
|
|
ItZnewz |